A Thermal Perspective of Dependability in Systems on Chip

A Thermal Perspective of Dependability in Systems on Chip
Venue:

NSF Variability Expedition - SPP1500 Joint Workshop

In:

UC Irvine

Date:

February 25, 2013

Place:

Irvine, USA

Speaker:

Jörg Henkel

Abstract:

The first part of the talk introduces to some basics of on-chip reliability from a thermal point of view i.e., how heat/temperature is related to reliability. We explain NBTI and Electromigration etc., and show that many reliability-related mechanisms are accelerated by temperature. We also discuss challenges posed by, and solutions for how to estimate and measure temperature. The second part introduces some of our concepts on how to control on-chip temperature through mechanisms such as load balancing etc.