Special Session at DATE 2014
| Name: | Connecting different worlds – technology abstraction for reliability-aware design and test |
Place: | Dresden, Germany |
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| Venue: | DATE 2014 |
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| Date: | March 27, 2014 |
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| Project Leader: | Ulf Schlichtmann, Andreas Herkersdorf |
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The rapid shrinking of device geometries in the nanometer regime
requires new technology-aware design methodologies.
These must be able to evaluate the resilience of the circuit throughout all System
on chip (Soc) abstraction levels.
to successfully guide design decisions at the system level, reliability models, which abstract technology information, are required to identify those parts of the system
where additional protection in the form of hardware or software
countermeasures is most effective. Interfaces such as the presented resilience
articulation
point (rap
) or the
reliability Interchange Information Format (rIIF) are required to enable
eDa-assisted analysis
and propagation of reliability information.
the models are discussed
from different perspectives, such as design and test.
