A Thermal Perspective of Dependability in Systems on Chip

  • Venue:

    NSF Variability Expedition - SPP1500 Joint Workshop

  • Date:

    February 25, 2013

  • Speaker:

    Jörg Henkel

  • Abstract:

    The first part of the talk introduces to some basics of on-chip reliability from a thermal point of view i.e., how heat/temperature is related to reliability. We explain NBTI and Electromigration etc., and show that many reliability-related mechanisms are accelerated by temperature. We also discuss challenges posed by, and solutions for how to estimate and measure temperature. The second part introduces some of our concepts on how to control on-chip temperature through mechanisms such as load balancing etc.


  • In:

    UC Irvine

  • Place:

    Irvine, USA