Design, Automation & Test in Europe (DATE)

March 16, 2012

Mehdi Tahoori,
Jörg Henkel,
Andreas Herkersdorf,
Wolfgang Rosenstiel,
Oliver Bringmann,
Sani Nassif,
Norbert Wehn

Organisers:
Mehdi Tahoori, Karlsruhe Institute of Technology, DE
Jörg Henkel, Karlsruhe Institute of Technology, DE
Andreas Herkersdorf, TU Munich, DE
Wolfgang Rosenstiel, Tuebingen U and edacentrum, DE
Oliver Bringmann, FZI Karlsruhe, DE
Norbert Wehn, U Kaiserslautern, DE
Sani Nassif, IBM, US

Improvements in chip manufacturing technology have propelled an astonishing growth of embedded systems which are integrated into our daily lives. However, this trend is facing serious challenges, both at device and system levels. As the minimum feature size continues to shrink, a host of vulnerabilities influence the robustness, reliability, and availability of embedded and critical systems. Some of these factors are caused by the stochastic nature of the nanoscale manufacturing process (e.g. process variability, sub-wavelength lithographic inaccuracies), while other factors appear because of high frequencies and nanoscale features (e.g. RLC noise, on-chip temperature variation, increased sensitivity to radiation and transistor aging).
 
The objective of this workshop is to bring the attention of design automation community to the multi-level reliability challenges and solutions and possible paradigm shift to consider reliability throughout the design flow, from devices to systems and applications. In addition, this workshop tries to introduce and promote various existing coordinated research programs on dependability which are currently underway in Europe, Asia, and USA to deal with multi-level reliability challenges. We plan to review the overlap and synergy among these programs in order to explore how they can complement each other. The goal is to have further collaborations among these programs such that the overall design and test automation community can benefit more from the outcomes of these programs.
 
Program:
 

08:30 Session 1: OPENING
 
Welcome Address
 
Mehdi Tahoori, KIT, DE

08:45 Keynote Address - Why Resilience Matters
 
Sani Nassif, IBM Research, Austin, US
 

09:30 Session 2: COORDINATED DEPENDABILITY PROGRAMS - PART I
 
German Research Foundation (DFG) priority program on “Dependable Embedded Systems”
 
Jörg Henkel, KIT, DE

10:00 Japan Science and Technology Agency (JST) program on “Dependable VLSI platform Project”
 
Hidetoshi Onodera, Kyoto U, JP
 

10:30 Coffee Break
 

11:00 Session 3: COORDINATED DEPENDABILITY PROGRAMS - PART II
 
US National Science Foundation (NSF) program on “Variability Expeditions”
 
Nikil Dutt, UCI, US

11:30 EU COST Action on “Manufacturable and Dependable Multicore Architectures at Nanoscale”
 
Marco Ottavi, U Roma, IT
 

12:00 Lunch Break
 

13:00 Session 4: DEVICE, CIRCUIT, AND ARCHITECTURE RELIABILITY
 
Device reliability: The never-ending challenge
 
Christian Schluender, Infineon, DE

13:30 Design efforts and time zero screening methods to ensure high end processor reliability
 
Dieter Wendel, IBM, DE
 

14:00 Workload Dependencies of Aging Effects
 
Rob Aitken, ARM, US
 

14:30 Coffee Break + Poster Session
 

15:00 Session 5: SYSTEM AND APPLICATION DEPENDABILITY
 
Error Resilience in Wireless Communication Systems
 
Norbert Wehn, U Kaiserslautern, DE

15:30 Dependability issues in automotive electronics
 
Werner Kanert, Infineon Technologies, DE

16:00 Session 6: PANEL DISCUSSION
 
An inter-continental approach to solve dependability challenges
 
Panelists:
 
Nikil Dutt, UCI, US
 
Jörg Henkel, KIT, DE
 
Sani Nassif, IBM, US
 
Hidetoshi Onodera, Kyoto U, JP
 
Marco Ottavi, U Roma, IT
 

16:45 Concluding Remarks
 

Dresden, Germany

2012